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News & Trends (Sorted By Date)
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Oracle takes on IBM in mission critical systems space (30/10/15)
[ Processors/DSPs ]
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Startup develops wireless charging tech for IoT, wearables (30/10/15)
[ RF/Microwave ]
- Imec, Ghent University roll thermoplastically deformable ICs (30/10/15) [ Manufacturing/Packaging ]
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Netmagic Solutions to build 3 more data centres (29/10/15)
[ Memory/Storage ]
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HP CTO: IoT, 3D printing will drive computing forward (29/10/15)
[ Manufacturing/Packaging ]
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IoT start-up unveils end-to-end platform for 802.15.4 network (29/10/15)
[ Networks ]
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IDT to buy ZMDI for ₹1.9 crore (28/10/15)
[ Power/Alternative Energy ]
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How long will chip M&As' impacts last? (28/10/15)
[ Manufacturing/Packaging ]
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Building automation firm enters IoT network space (28/10/15)
[ RF/Microwave ]
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Car market offers bright prospect for magnetic sensors (28/10/15)
[ Sensors/MEMS ]
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Worldwide IC market gets dull outlook for 2H15 (28/10/15)
[ Manufacturing/Packaging ]
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India's public cloud services to reach $731M in 2015 (27/10/15)
[ Networks ]
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Graphene wrinkles show promise as semiconducting mat'l (27/10/15)
[ Manufacturing/Packaging ]
- ZF combines electromobility activities to streamline ops (27/10/15) [ Manufacturing/Packaging ]
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64bit x86 SoCs target high-performance embedded apps (27/10/15)
[ Embedded ]
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LG Display beefs up OLED clout with recent buy (27/10/15)
[ Optoelectronics/Displays ]
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A little tilt goes a long way: Boosting PV efficiency (26/10/15)
[ Power/Alternative Energy ]
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Connected cars can't hold a candle to hackers, survey says (26/10/15)
[ EDA/IP ]
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Bringing 'ethical' behaviour to driverless cars (26/10/15)
[ Embedded ]
- Factories offer strong market appeal for IoT (26/10/15) [ Manufacturing/Packaging ]
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Dell churns out latest semi-custom servers for cloud (26/10/15)
[ Processors/DSPs ]
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Dense IoT market to give low-power Wi-Fi adoption snag (26/10/15)
[ RF/Microwave ]
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Can encrypted CAN bus secure connected cars? (23/10/15)
[ Embedded ]
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IoT and security: Like mixing oil and water? (23/10/15)
[ EDA/IP ]
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Why is hardware important to the Internet of Things? (22/10/15)
[ Embedded ]
- Using IoT, cloud to cut car production cost, time-to-market (22/10/15) [ EDA/IP ]
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ARM GPU to bring smartphone-quality graphics to wearables (22/10/15)
[ Processors/DSPs ]
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LCD TV panel inventory control to drag down demand (22/10/15)
[ Manufacturing/Packaging ]
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Modi highlights Indian talent in Silicon Valley (21/10/15)
[ EDA/IP ]
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Grid connection sol'n to slash offshore wind power cost (21/10/15)
[ Power/Alternative Energy ]
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Biodegradable displays show promise in cutting e-waste (21/10/15)
[ Manufacturing/Packaging ]
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On Semi buys sub-GHz radio chip vendor (21/10/15)
[ RF/Microwave ]
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Apple ordered to pay WARF $234M for patent infringement (21/10/15)
[ EDA/IP ]
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HCL buys eng'g firm to drive industrial IoT (20/10/15)
[ Embedded ]
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Coexistence measurements promise excellent car connectivity (20/10/15)
[ EDA/IP ]
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4 security threats to the Internet of Things (19/10/15)
[ EDA/IP ]
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Three tech megatrends expected to send waves across industry (19/10/15)
[ EDA/IP ]
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Wi-Fi, cellular tug-of-war begins (19/10/15)
[ RF/Microwave ]
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Clash of connected cars: LTE V2X takes a stand against DSRC (19/10/15)
[ RF/Microwave ]
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Renesas outlines Synergy platform for embedded design (19/10/15)
[ EDA/IP ]
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Reducing solar energy cost using iron-based dyes (16/10/15)
[ Power/Alternative Energy ]
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Digital instrument cluster sol'n displays safety info in 3D (16/10/15)
[ Embedded ]
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Bringing high-speed data to the world's data centres (16/10/15)
[ RF/Microwave ]
- 'Unsure' sensor: Promising safety amid product failures (16/10/15) [ Sensors/MEMS ]
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Innovation woes: Why must we always blame others? (15/10/15)
[ Embedded ]
- ADI, ThingWorx to provide cloud environment for IoT apps (15/10/15) [ EDA/IP ]
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Batteries, fuel cells to power next-gen electric cars (15/10/15)
[ Power/Alternative Energy ]
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IBM unveils first public data centre in Chennai (14/10/15)
[ Memory/Storage ]
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Rohde & Schwarz, Tata Power ink MoU for 'MAKE in INDIA' (14/10/15)
[ T&M ]
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'Nanohoops' show promise in power, med apps (14/10/15)
[ Manufacturing/Packaging ]
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