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News & Trends (Sorted By Date)
- Understanding supplier relationship: How to cut risk (28/07/15) [ Manufacturing/Packaging ]
- Activist investor strategic to Q'comm's 4,700 layoffs (28/07/15) [ Processors/DSPs ]
-
Why V2V technology is crucial for connected cars (27/07/15)
[ Sensors/MEMS ]
- Tablet processors drop as smartphone processor market rises (27/07/15) [ Processors/DSPs ]
- Expanding smart cities get a boost (27/07/15) [ EDA/IP ]
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Dealing with the limits of automated driving (24/07/15)
[ Sensors/MEMS ]
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Qualcomm plans 4,700 layoffs (24/07/15)
[ Manufacturing/Packaging ]
-
Oculus VR seeks to buy hand-motion start-up (24/07/15)
[ Sensors/MEMS ]
-
Univ. of Pune student designs 'ultimate' dev kit (23/07/15)
[ EDA/IP ]
- High-power LEDs target automotive HUDs (23/07/15) [ Optoelectronics/Displays ]
- Bosch, TomTom to create maps for self-driving cars (23/07/15) [ Embedded ]
- Research integrates battery charging, valet parking (23/07/15) [ EDA/IP ]
- Korean startup develops ultra-lightweight solar charger (23/07/15) [ Power/Alternative Energy ]
-
Phosphorene paves way for ultrathin solar cells, LEDs (22/07/15)
[ Manufacturing/Packaging ]
- ARM, Digi-Key team up to deliver university programme (22/07/15) [ EDA/IP ]
- Kickstarter campaign: Reasons not to do it (22/07/15) [ EDA/IP ]
- Understanding the power systems of self-driving cars (22/07/15) [ Power/Alternative Energy ]
- Improving NAND performance with better error correction (22/07/15) [ Memory/Storage ]
-
5 tech trends in PV technology (21/07/15)
[ Power/Alternative Energy ]
- Novel materials enhance LED performance (21/07/15) [ Manufacturing/Packaging ]
- Inquiry on Qualcomm's sales practices begins (21/07/15) [ RF/Microwave ]
- TSMC makes conservative outlook for 2015 (21/07/15) [ Manufacturing/Packaging ]
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IBM cuts power to 0.3V for 7nm (20/07/15)
[ Manufacturing/Packaging ]
- Intel logs $2.2B revenue amid drop in PC sales (20/07/15) [ Processors/DSPs ]
- Slashing production costs of perovskite-based solar cells (20/07/15) [ Manufacturing/Packaging ]
- Slowdown in PCs, smartphones to drag chip sales (20/07/15) [ Manufacturing/Packaging ]
- Smartphone overheating: Benchmarks reveal answers (20/07/15) [ Power/Alternative Energy ]
-
UMC 28nm process gets IO pad library from Indian start-up (16/07/15)
[ EDA/IP ]
- Audi robot racing car tops human-driven racing car (16/07/15) [ Embedded ]
- Exploring long-life batteries issues (16/07/15) [ Power/Alternative Energy ]
- Tesla battery pack may slash supply chain power costs (16/07/15) [ Power/Alternative Energy ]
-
Millimetre wave boosts V2V communication (15/07/15)
[ RF/Microwave ]
- Renesas, Audi partner to speed automotive innovation (15/07/15) [ Embedded ]
- Big data analytics may boost defect detection in cars (15/07/15) [ Manufacturing/Packaging ]
- RISC-V reveals advantages over x86, ARM (15/07/15) [ Processors/DSPs ]
- Why Globalfoundries is embracing FD-SOI and why now (15/07/15) [ Manufacturing/Packaging ]
-
ECE students in India get scholarship from Mouser (14/07/15)
[ EDA/IP ]
- Graphene-based film touts 4X thermal conductivity of Cu (14/07/15) [ Manufacturing/Packaging ]
- How the Apple Watch changed my life (14/07/15) [ Embedded ]
- Cognitive companion: Imagining the perfect smartphone (14/07/15) [ Embedded ]
-
Indian scientists develop light-driven battery (13/07/15)
[ Power/Alternative Energy ]
- Smart watches to boost market for cover glass (13/07/15) [ Manufacturing/Packaging ]
- Hypervisor tech to integrate complex car platforms (13/07/15) [ Embedded ]
- Uphill's ISSI buy: Digging deeper for details (13/07/15) [ Manufacturing/Packaging ]
- IBM overtakes Intel with 7nm node (13/07/15) [ Manufacturing/Packaging ]
-
Wafer fab in India to run as speciality foundry (10/07/15)
[ Manufacturing/Packaging ]
- MEMS shipments to reach 43.3 billion units by 2018 (10/07/15) [ Sensors/MEMS ]
- Industry 4.0 carves promising road to smart manufacturing (10/07/15) [ EDA/IP ]
- 5G field trails to start as early as next year (10/07/15) [ RF/Microwave ]
-
Woman on top: Ex-Intel president takes external CEO role (10/07/15)
[ EDA/IP ]
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