Bluetooth Smart IC enables scatternet, IoT, wearable apps

Toshiba America Electronic Components Inc. has unveiled the latest addition to its portfolio of Bluetooth Low Energy (BLE) communication ICs. The TC35667WBG-006 adopts Bluetooth Core Specification v4.1 and is aimed at scatternet devices as well as Bluetooth Smart applications such as wearable sport and lifestyle products, remote controls, smartphone accessories and devices for the Internet of Things (IoT).

The Bluetooth Core specification for version 4.0 and higher defines two standard scatternet functions. Adopted devices have to support either multiple or simultaneous connections with master and slave devices, or multiple connections between two or more master devices at the same time. Toshiba's latest IC supports both functions with BLE, simplifying creation of a network with very small devices, the company stated.

The TC35667WBG-006's combination of functionality and compact size—wafer chip-scale package (WCSP) dimensions are just 2.88mm x 3.04mm x 0.3mm high—makes it well suited to equip a BLE communication network in low-profile applications such as contactless cards, tags and tickets.

Compatible with voltages of 1.8V to 3.6V and temperatures of -40°C to 85°C, the IC operates with current consumptions down to 5.9mA and has a deep sleep mode that, when activated, reduces current consumption to just 0.5μA. On-board functionality includes DC/DC converter, low-dropout regulator, general-purpose ADC and pulse-width modulation. User programme function and a wake-up signal for a host device are also available, added Toshiba.

Samples of the TC35667WBG-006 BLE chip have begun shipping.