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Qualcomm, TDK ink JV to deliver RF front-end sol'ns

Posted: 15 Jan 2016     Print Version  Bookmark and Share

Keywords:Qualcomm  TDK  IoT  RF  robotics 

Qualcomm Inc. TDK Corp. announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd. The joint venture will draw upon TDK's capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm's expertise in advanced wireless technologies to serve customers with leading-edge RF solutions into fully integrated systems.

In addition to creating RF360 Holdings, Qualcomm and TDK will expand their collaboration around key technology fields, including sensors and wireless charging.

The agreement is subject to receipt of regulatory approvals and other closing conditions and is expected to close by early 2017.

"TDK is a leading electronic components manufacturer with cutting-edge expertise in RF filters and modules, and we are looking forward to deepening our collaboration and together accelerating innovation and better serving the ecosystem for next-generation mobile communications," said Steve Mollenkopf, CEO of Qualcomm. "The joint venture's RF filters will bolster Qualcomm RF360 front-end solutions to enable Qualcomm Technologies Inc. (QTI) to deliver a truly complete solution to the ecosystem. This will enable us to expand our growth opportunity by allowing us to accelerate our strategy to provide OEMs across our business segments with fully integrated systems that will enable them to deliver at scale and on an accelerated timeframe."

"The joint venture with Qualcomm is a win for both companies, which complement each other ideally," said Takehiro Kamigama, president and CEO of TDK. "Customers will benefit from our unique and comprehensive portfolio, which will further strengthen TDK's position in key growth business segments and open new and exciting business opportunities. In this context, it was a major objective to ensure that our customers can continue to expect a seamless supply of discrete filters and duplexers, as well as modules."

RF360 Holdings poised to meet challenging RF industry requirements

Together with RF360 Holdings, QTI will be ideally positioned to design products from the modem/transceiver to the antenna in a fully integrated system.

RF360 Holdings will have a comprehensive set of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) to support the wide range of frequency bands being deployed in networks across the globe. Moreover, RF360 Holdings will enable the delivery of RFFE modules that will include front-end components designed and developed by QTI. These components include CMOS, SOI and GaAS power amplifiers, a broad portfolio of switches enhanced via a recent acquisition, antenna tuning and envelope tracking.

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