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Cloud connectivity kit minimises dev't time for IoT apps

Posted: 04 Dec 2015     Print Version  Bookmark and Share

Keywords:NXP Semiconductors  cloud  IoT  NFC 

NXP Semiconductors N.V. has introduced the LPC43S67-A70CM Cloud Connectivity Kit geared to slash the time-to-market for deploying IoT products. The solution aims to help designers bridge the gap between unconnected embedded products to cloud-connected products without requiring deep expertise in security, WiFi stacks, device commissioning and cloud service APIs.

NXP collaborated with ecosystem partner, Zentri, known for creating a single platform stack that helps companies build connected products for the IoT market, to combine the NXP LPC43S67 MCU, A7001CM secure element and NTAG I2C NFC, a Murata SN8000 802.11b/g/n module, with the Zentri Secure Connected Product Platform. The kit is designed to simplify the effort and reduce the time needed to create and deploy secure, connected products such as vending machines, personal health devices and interactive displays, industrial products used for factory automation, industrial gateways and diagnostic equipment, as well as consumer products used in the home, such as washing machines and thermostats.

According to the company, the LPC43S67-A70CM Cloud Connectivity Kit jumpstarts all three key aspects of developing an IoT product: security and connectivity of the physical device, including secure cloud-based device management for provisioning and remote management; developing applications for end users and connected users; and protocol-agnostic cloud connectivity to support the connected functionality and services.

The LPC43S67-A70CM Cloud Connectivity Kit includes: 1) Reference hardware: LPCXpresso43S67 board based on the NXP LPC43S67 MCU and A7001CM secure element, an NXP LPC General Purpose Shield, an NXP NFC NTAG I2C board, and Murata SN8000 802.11b/g/n (SD card); and 2) Zentri Secure Connected Product Platform: the ZentriOS, ZentriOS SDK, ZentriDMS and Zentri Mobile App SDK.

The LPC43S67-A70CM Cloud Connectivity Kit will available from NXP distributors in December. Production quantities of the NXP LPC43S67 MCU, A7001CM secure element, and NFC NTAG I2C are available now from NXP distributors.

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