Global Sources
EE Times-India
Stay in touch with EE Times India
 
EE Times-India > RF/Microwave
 
 
RF/Microwave  

Renesas rolls 3rd gen single-chip powerline modem sol'n

Posted: 22 Oct 2015     Print Version  Bookmark and Share

Keywords:Renesas Electronics  powerline  modem  PLC protocol 

Renesas Electronics has unleashed the third generation of its OFDM powerline (PLC) modem solution, which continues to provide the flexibility to support any PLC protocol standard such as PRIME1.3.6/1.4 and G3, for all global frequency bands including CENELEC A, FCC and ARIB. The single-chip solutions promise to significantly reduce time-to-market, minimise risk and maximise system cost efficiency.

With its increased memory headroom and boosted protocol processing performance, new generation PLC protocols such as PRIME 1.4 with full band-plan coverage can be supported. In addition, functions like dual-route communication can be implemented, helping customers to differentiate their products.

Renesas powerline modem solution

With the constant evolution of the metering market and the rise of smart meters, the metering manufacturers face many challenges in developing new smart grid systems including smart meters and concentrators to support ever changing needs. Governments and utility providers are drivers of this change and in many cases the tenders for the various mass deployments are divided into multiple tranches with different specifications and schedules. In response to this scenario, the meter manufacturers have to develop solutions to meet a rapid time to market requirement as well as a low total cost of ownership, at minimum risk. The clear solution is a flexible platform approach that meets the multiple PLC communications standards needed for pan-European and global solutions. The third generation of Renesas' flexible software defined multi-standard powerline solution fully meets these requirements.

With the proven record of success of the Renesas powerline solution predecessor devices, the aim for the new generation was to reduce overall BOM cost, to increase robustness, to increase performance and to even have the ability to support dual route communication where required. The modem device integrates an enhanced MAC controller supporting large scale network hopping and routing as well as a high performance DSP with special instructions for PLC, covering the PHY and real time processes of the media access protocol (MAC) implementation. Furthermore, DSP algorithms are implemented to improve robustness by using noise detection, noise reduction and error correction mechanisms. Exceptional signal quality and a wide dynamic range are ensured by the embedded analogue front end (AFE) with an integrated adaptive gain amplifier including automatic gain control (AGC) functions. The integration of the LDO regulator, the DC/DC converter and the transmit filters in turn leads to a reduced noise impact from the power supply as well as to an overall reduced BOM.

A dedicated reference platform (YCONNECT-IT-PLC-CPX3) provides customers with flexible device configuration. The protocol stacks, including the related frequency bands, can be selected and the communication easily analysed with a dedicated PC GUI. It also allows the customisation of the evaluation software to the customer's own test environment as well as the configuration of their test cases.





Comment on "Renesas rolls 3rd gen single-chip po..."
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

 
Back to Top