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EE Times-India > EDA/IP

SoC vs. SiP: Highlighting the changing mobile, IoT space

Posted: 13 Oct 2015     Print Version  Bookmark and Share

Keywords:SoC  SiP  IoT  wearable  big data 

There are many compelling reasons why SiP is stimulating heightened interest and discussion across the expanding electronics ecosystem. Many ecosystem players are coming to realise the numerous benefits, including integrated/embedded passives, heterogeneous components, smaller and simplified system boards, improved signal integrity, reduced power consumption, and decreased component size and thickness. Further simplification is achieved through module level test and qualification, reduced system BOM and complexity, as well as the significant fact that SiP technology is flexible, re-usable and re-configurable. SiP technology flexibility is particularly important to design in product functionality and differentiation, and perhaps in contributing to solutions that address concerns relating to privacy and security.

According to Prismark Partners, the global wearables market is estimated to grow at 41 per cent CAGR in revenue from 2014-2019, and to reach 259 million units annual shipment in 2019. For many emerging players, success within an increasingly dynamic market hinges on creating and sustaining solid and highly productive manufacturing partnerships. It is not enough for manufacturing partners to merely collaborate closely with customers. Indeed, manufacturing partnerships, such as those within the OSAT community, must enhance the value they bring through anticipating markets and creating value propositions that deliver advanced packaging and SiP solutions to meet growth momentum across a broad range of application driven end markets.

In summary, smartphone, mobile and IoT products are driving functional integration and miniaturisation, with SiP firmly establishing itself across the industry, supply chain and ecosystem. The drive for heterogeneous device integration, decreased size, lower cost, and reduced time to market and revenue is leading many established and emerging players to explore the value proposition of SiP. As an industry, we are at an early stage of a collaborative work-in-process. Architecture, design, core packaging technologies and heterogeneous components must be further developed, meaning there is huge need for orthogonal thinking and lateral innovation. System, IC and packaging designers and technologists must collaborate across multi-disciplinary boundaries and an expanding ecosystem to innovate ideas and to implement new solutions to bring SiP fully into the mainstream. While Moore's Law is slowing after 50 years, SiP and heterogeneous integration are taking up the challenge to continue the promise of Moore's Law "integration" benefits for the next quarter century, and perhaps beyond.

- William Chen
  ASE Group

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