Global Sources
EE Times-India
Stay in touch with EE Times India
 
EE Times-India > RF/Microwave
 
 
RF/Microwave  

GaN-on-SiC, packaging tech to speed up DOCSIS 3.1 deployment

Posted: 09 Oct 2015     Print Version  Bookmark and Share

Keywords:Qorvo  DOCSIS 3.1  GaN-on-SiC  multi-chip module  cable TV 

Qorvo Inc. has rolled out a number of innovations geared to expedite the deployment of high-speed cable TV (CATV) DOCSIS 3.1 networks while giving cable designers greater flexibility in product design. Qorvo's latest multi-chip module (MCM) packaging, thermal sensing pins, and advanced gallium nitride on silicon carbide (GaN-on-SiC) integration capabilities aim to enable CATV product designers to lower costs, increase bandwidth and minimise board space, detailed the company.

Qorvo's MCM packaging helps customers reduce board space by up to 50 per cent and enables up to 30 per cent cost savings versus traditional SOT115J packaging, the company stated. Qorvo's MCM packaging includes temperature-sensing pins, which ensure proper assembly and provide optimal thermal management. To facilitate the use of its advanced MCM capabilities, Qorvo offers customers PCB layout and thermal design support services.

Multi-system operators (MSOs) can leverage the market leading output and gain performance of Qorvo's GaN on SiC technology to upgrade equipment within existing product footprints, saving installation time and cost while enhancing performance. Additionally, Qorvo's GaN on SiC technology helps reduce overall power consumption by up to 20 per cent with associated features such as adjustable current control.

Qorvo's DOCSIS 3.1 solution

Qorvo's latest DOCSIS 3.1 products include the RFCM3316 and RFCM3326 GaN-based power doubler amplifiers and are available in miniaturised 9mm x 8mm MCM packaging. The DOCSIS 3.1 forward path amplifiers operate from 45MHz to 1.2GHz with very high output (capable of 74dBmV composite power), extremely low distortion (lower than 70dBc), and excellent input and output return loss (-20dB typical). Qorvo's reverse path amplifiers operate up to 300MHz with integrated attenuator and power down function.

The DOCSIS 3.1 products are available in MCM, SOT-115J and standard monolithic microwave integrated circuit (MMIC) packages, including QFN, SOT89 and SOIC. Qorvo's MMIC products include gain amplifiers, low equivalent input noise current (EINC) trans-impedance amplifiers (TIA), attenuators, switches, filters and complete optical receivers for RF over glass (RFoG) and passive optical network (PON) applications. Qorvo's DOCSIS 3.1 solutions claims to employ the latest high-performance process technologies including GaN high-electron-mobility transistor (HEMT) technology, which delivers superior linearity, output power and reliability.





Comment on "GaN-on-SiC, packaging tech to speed ..."
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

 
Back to Top