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ARM-based chipsets target HD HEVC entry STBs

Posted: 22 Sep 2015     Print Version  Bookmark and Share

Keywords:STMicroelectronics  STB  SoC  chipset  HEVC 

STMicroelectronics has rolled out its line of HD HEVC Liege3 chipsets for entry set-top-box (STB) markets composed of satellite variants (STiH337/STiH332), cable-market products (STiH372) and IPTV STB devices (STiH307/STiH302).

More than just an upgrade of previous-generation devices, the chipset family combines the latest architectures used in ST's Cannes (STiH310/STiH312/318) products with optimised IPs to deliver future-proof SoCs with high integration, stated the company. This will enable large-scale migration of entry set-top boxes towards high efficiency video coding (HEVC).

ST's STB devices benefit from a scalable hardware and software architecture enabling flexible platform configurations to reach optimised price/user experience ratio across the different HD HEVC entry STB segments. All chipsets in the ARM-based family are pin-to-pin compatible to facilitate design re-use among the different broadcast technologies. Software compatibility with ST's Cannes SoC family enables OEMs to benefit from the comprehensive ecosystem in order to easily design innovative client boxes on multiple middleware products.

Addressing the satellite markets, the STiH337/STiH332 SoCs implement a DVB-S2X demodulation scheme enabling multiple system operators (MSOs) to leverage compression-efficiency improvements brought by the HEVC technology. This results in the enhancement of S2X spectral efficiency for optimal use of the satellite transponder capacity, noted the company.

Key features of ST's STB SoC family that ranges from entry-level 2.5 K DMIPS without GPU up to 5K DMIPS with embedded GPU include: ARM CPU capable of delivering up to 5K DMIPS for advanced user interface and complex middleware; Mali 400 GPU for fluid user interface and HTML5 support on connected platforms; HEVC 10bit performance proven by extensive interoperability tests performed with all major encoder providers; rich set of future-proof connectivity options including Ethernet, USB 3, PCIe, HDMI; integrated DVB-C or DVB-S2X demodulator; HDR support; advanced security engine enabling CAS- and DRM-based secure video- content protection; and 28nm FD-SOI technology, providing highly-efficient RF and analogue integration as well as outstanding power efficiency at all operating levels, enabling very small fan-less designs.

The Liege3 SoC family is sampling to lead customers.





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