Global Sources
EE Times-India
EE Times-India > EDA/IP

EDA coding sol'n streamlines thermal simulation

Posted: 28 May 2015     Print Version  Bookmark and Share

Keywords:Mentor Graphics  EDA  PCB  thermal management  electronic system 

Mentor Graphics Corp. has uncloaked the latest version of the FloTHERM XT software product with advanced thermal management capabilities for electronic systems, PCB and packages of any geometric complexity. According to the company, the FloTHERM XT product is touted as the industry's first integrated mechanical design automation (MDA) and electronic design automation (EDA) electronics cooling solution.

The solution from Mentor features a CAD-centric technology and a robust mesher that simulates complex geometries with ease, speed and accuracy. The FloTHERM XT product also supports transient analysis, Joule heating, parametric studies, extended EDA integration capabilities and additional modeling options, including a cutting-edge ability to represent copper in detail for complex PCBs. These capabilities provide an ideal solution for the thermal simulation of electronic devices used in a range of markets such as automotive, transportation, consumer electronics, industrial automation as well as aerospace and defence.

FloTHERM XT product with EDA connectivity

For thermal specialists and design engineers, the FloTHERM XT product provides early design virtual prototyping and advanced "what-if" analysis for improved product quality, minimised design iterations and faster time to market. The product capabilities include:

Transient analysis: Time-varying analyses across all industrial applications is enabled with the FloTHERM XT modern solver and intuitive user interface (UI).

Component and board manipulation: Time is saved by importing any board and component layout and easily modifying data for position, size, orientation, shape and modeling level prior to transfer to the FloTHERM XT product.

Joule heating: Comprehensive analysis platform predicts current density, electric potential and associated Joule heating effects in complex electronics systems, PCBs and other high-power devices, a valuable feature for automotive and power electronics applications.

Parametric study: A new integrated environment for defining, solving and analysing results for parametric variations of geometry, attributes (e.g. material, thermal) plus solution parameters significantly enhances the design optimisation process.

EDA tool connectivity: A new ODB++ interface for non-Mentor Graphics layout tools supports Cadence, Zuken and Altium and helps users save time by providing increased user flexibility and use of existing EDA data.

New modeling options: PCB copper nets and traces are represented in full 3D detail, critical for higher-fidelity solutions or high-power applications using Joule heating effects for critical devices on a board.

Enhanced UI: easy-to-use interface and enhanced functionality enables efficient use of the FloTHERM XT software for an improved intuitive user experience.

The loTHERM XT product is available for immediate shipment.

Comment on "EDA coding sol'n streamlines thermal..."
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.


Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top