Goepel electronics unveils optical, X-ray systems line-up

Goepel electronics has announced the PILOT Connect interface system that can link all inspection data for automated optical, solder paste and X-ray inspection. The system collects and manages the operating data of the connected systems, as well as merges all test data onto a repair and verification station, detailed the company.

The optical system claims to meet a large spectrum of different industrial applications, ranging from stand-alone systems to high-end inline systems. In addition, Goepel is set to unveil a 3D automatic optical inspection system with telemetric measurement technology. The company claims that its AdvancedLine 3D is the first such system on the market.

X-ray inspection systems detect cracks, ruptures and other structural irregularities hidden to the human eye. For this kind of inspection tasks, the company will unleash its X-Line 3D. This inline system can handle a comprehensive range of X-ray as well as optical inspection tasks, stated Goepel. Combining both disciplines, the AXOI system promises to provide the ability to see beneath the surface, revealing hidden details that can be critical for the product quality.

With a number of JTAG/Boundary Scan modules, Goepel increases the test coverage for this technology. The ChipVORX module FXT-X32/HSIO4 enables users to test high-speed data bus systems such as PCIe, eSATA or USB 3.0. Boasting the world's first JTAG controllable Tester-on-Chip (ToC), the FXT96 module represents the vendor's latest generation module for testing analogue, digital and mixed signal applications.

- Christoph Hammerschmidt
  EE Times Europe