Global Sources
EE Times-India
Stay in touch with EE Times India
EE Times-India > Power/Alternative Energy
Power/Alternative Energy  

8mm x 8mm package minimises PCB stress for automotive apps

Posted: 06 Apr 2015     Print Version  Bookmark and Share

Keywords:Vishay Intertechnology  MOSFET  automotive 

Vishay Intertechnology Inc. has announced an 8mm x 8mm x 1.8mm PowerPAK 8x8L package geared to deliver a high-current, space- and power-saving alternative to D2PAK and DPAK devices generally used in automotive applications. The Vishay Siliconix SQJQ402E 40V TrenchFET power MOSFET claims to be the industry's first AEC-Q101-qualified MOSFET to use the compact footprint.

The SQJQ402E offers high-temperature operation to 175°C to provide the ruggedness and reliability required for automotive applications such as motor drives, electric power steering, transmission control and injector drives. The internal construction of the device's PowerPAK 8x8L package promises to cut inductance and enables a low maximum on-resistance of 1.5mΩ at 10V and 1.8mΩ at 4.5V. Additional design features also provide very high continuous drain current capability up to 200A. The SQJQ402E signals the release of an extensive roadmap of MOSFETs that will allow designers to exploit the benefits of this package in a multitude of automotive applications, Vishay added.


The device also features gull-wing leads specifically designed to reduce PCB solder joint stress caused by the wide range of operating temperatures commonly experienced in automotive applications. This approach has been successfully implemented in Vishay's smaller 5mm x 6mm PowerPAK SO-8L package. While the D2PAK and DPAK contain lead (Pb), the PowerPAK 8x8L exceeds current RoHS standards and is completely lead (Pb)-free.

To save PCB space and costs, and enable the creation of smaller and lighter modules in applications where multiple MOSFETs are often required, the SQJQ402E offers similar on-resistance and higher continuous current than devices in the D2PAK, while providing a 60 per cent smaller footprint area and 60 per cent thinner profile. To save power, the SQJQ402E offers half the on-resistance, twice the current, and a 21 per cent smaller profile than devices in the DPAK, all with only a 12 per cent larger footprint.

Samples of the SQJQ402E are available. Production quantities will be available in Q2, with lead times of 13-14 weeks for large orders.


Comment on "8mm x 8mm package minimises PCB stre..."
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.


Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top