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Microsemi debuts SmartFusion2 advanced dev't kit

Posted: 01 Oct 2014     Print Version  Bookmark and Share

Keywords:Microsemi  development kit  FPGA  system-level design  eNVM 

Microsemi Corp. has released what it says is its largest density, lowest power SmartFusion2 150K LE SoC FPGA advanced development kit. According to the company, the kit has a couple of FPGA Mezzanine Card (FMC) expansion headers to connect various functions with off-the-shelf daughter cards, allowing board-level designers and system architects to quickly develop system-level designs.

Intended for communications, industrial, defence and aerospace markets, the SmartFusion2 SoC FPGA advanced development kit claims to offer a full featured 150K LE device SmartFusion2 SoC FPGA. The low power 150K LE device inherently integrates reliable flash-based FPGA fabric, a 166MHz Cortex M3 processor, digital signal processing (DSP) blocks, static random-access memory (SRAM), embedded nonvolatile memory (eNVM) and industry-required high-performance communication interfaces, all on a single chip, detailed the company.

The FMC headers provide designers additional cost savings, the ability to accelerate design development, and helps significantly reduce time-to-market on designs by providing the opportunity to leverage a range of standard off-the-shelf daughter cards for applications such as image and video processing, serial connectivity (SATA/SAS, SFP, SDI) and analogue (A/D, D/A). The release of this kit also complements Microsemi's expertise and IP in JESD204B, supporting the growing enterprise market for high speed data conversion for applications such as radar, satellite, broadband communications and communications test equipment.

Also included with the kit is a one-year platinum license for Microsemi's advanced Libero SoC design software, valued at $2,500. With the Libero SoC design software Microsemi has created enhanced ease-of-use and design efficiencies with leading edge design wizards, editors and scripting engines that allow customers a faster time-to-market for SmartFusion2 and IGLOO2 FPGA-based designs.

The SmartFusion2 SoC FPGA advanced development kit board has numerous standard and advanced peripherals such as: PCIe x4 edge connector, two FMC connectors for developing solutions offered with off-the-shelf daughter cards, USB, Philips inter-integrated circuit (I2C), two gigabit Ethernet ports, serial peripheral interface (SPI) and UART. A high precision operational amplifier circuitry on the board helps to measure core power consumption by the device, stated the company.

The SmartFusion2 SoC FPGA memory management system is supported by 1GB of onboard double data rate3 (DDR3) memory and 2GB SPI flash: 1GB connected to the microcontroller subsystem (MSS) and 1GB connected to the FPGA fabric. The serialiser and deserialiser (SERDES) blocks can be accessed through the peripheral component interconnect express (PCIe) edge connector or high speed sub-miniature push-on (SMA) connectors or through on-board FMC connector.

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