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Sensor signal conditioner integrates DSP

Posted: 10 Sep 2014     Print Version  Bookmark and Share

Keywords:sensor  signal conditioning  DSP 

Germany-based ZMD AG (ZMDI) unveiled an 18bit sensor signal conditioning IC with an integrated 24bit digital signal processor (DSP) for linearisation and calibration functions, optimised for automotive, industrial, medical, information technology and consumer applications.

The ZSSC3218 includes a smart power-save scheme to minimise overall current consumption, internal filter options for low-noise output signals, alarm and interrupt features. An internal supply regulator eliminates the need for an external buffer capacitor, making the IC well-suited for applications in harsh environments.


The device comes in a quadratic form factor, optimised for stacked die assembly. Source: ZMDI

Digital compensation of signal offset, sensitivity, temperature and non-linearity is accomplished via an internal correction algorithm with coefficients stored on-chip in a highly reliable, nonvolatile, multiple-time programmable memory. The device's serial interface with the PC-controlled calibration software provided in the development kit simplifies programming. The measured and corrected bridge values are provided at the digital output pins as I2C or SPI. The ZSSC3218 can also provide a corrected temperature output measured with an internal sensor.

With an almost noise-free 18bit output signal, the ZSSC3218 allows designs for high-precision measurement systems, including barometric altitude measurement for portable navigation or emergency call systems, altitude measurement for car navigation, pressure measurements inside hard disks and weather forecasting equipment. The device can also adopt thermopile sensors to enable contactless temperature measurements of objects or human body temperature.

"The ZSSC3218 is designed for use with resistive pressure sensors as well as absolute voltage sensors such as thermopiles," said Michael Georgi, Product Marketing Manager at ZMDI. "A new application is contactless temperature measurement based on thermopile sensors in mobile devices."

The ZSSC3218 is in full production and is available as die for wafer bonding. The device costs $1.20 in 50,000 units.

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