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2100Mb/s DDR3 memory offered in low-cost wire bond package

Posted: 19 May 2014     Print Version  Bookmark and Share

Keywords:Uniquify  DDR3 memory  DSCL  DABC  wire bond 

Uniquify, a supplier of high-performance semiconductor IP and SoC integration and manufacturing services, has revealed that it has achieved an ultrafast DDR3 performance of 2100Mb/s in a low-cost wire bond package. The DDR3 IP subsystem is implemented in a customer design in a low-power 28nm process for a high-volume consumer application needing the use of a low-cost wire bond package.

Uniquify was able to achieve 2100Mbps (1.05Ghz clock rate) performance in the selected wire bond package favoured by price-sensitive consumer electronics product manufacturers as an alternative to higher cost flip chip packages. This performance was made possible through application of Uniquify's adaptive technologies, dynamic self-calibrating logic (DSCL) and dynamic adaptive bit calibration (DABC).

The performance boost is due to Uniquify's patented and adaptive DSCL and DABC technologies built into its DDR PHY IP. DSCL dynamically tracks the DDR timing and automatically centres the sample point in the middle of the window, allowing the DDR clock speed to be increased without sacrificing stability or requiring the use of a more expensive package. DABC performs dynamic skew alignment at the bit level that further improves the quality of the DDR timing. The ability to achieve the highest performance with low system cost is a result of employing DSCL and DABC in the on-chip DDR IP subsystem.

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