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Imec, Besi to advance thermocompression bonding for 3D ICs

Posted: 22 Jan 2014     Print Version  Bookmark and Share

Keywords:3D IC  wafer bonding  manufacturing  thermocompression 

Imec on Monday revealed that it has teamed up with Besi, a Netherlands-based supplier of semiconductor assembly equipment, to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. This collaboration is expected to advance the industrial adoption of thermocompression bonding for 3D IC manufacturing.

One of the key challenges to making 3D IC manufacturing a reality is the development of high-throughput automated process flow for narrow-pitch, high-accuracy die-to-die and die-to-wafer bonding. Flip chip and reflow soldering, which are currently combined for bonding, require lenient bonding accuracy on large bump pitches (around 150-50µm bump pitch). Bump pitches need to further scale down to 40-10µm to realise a sufficiently high performance. This needs high accuracy in bonding within the range of 1-2um @3sigma.

Moreover, an automatic process flow is essential for industrial adoption. Thermocompression bonding is a method that enables this high bonding accuracy on narrow bump pitches, although with this comes long cycle times due to temperature and pressure profiles and processing methods which hinder industrial adoption of this technology up to now.

Imec and Besi will conduct joint research to develop a high-throughput thermocompression bonder in an automated process flow, with high accuracy and shorter cycle times, paving the way to enabling a production-ready 3D, 2.5D and 2.5D/3D hybrid technology.

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