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Guide to the assembly of GQFN, DFN packages

Posted: 17 Dec 2013     Print Version  Bookmark and Share

Keywords:handling  assembly  Freescale  QFN  DFN 

This document offers guidelines for the handling and assembly of Freescale QFN and DFN packages during printed circuit board (PCB) assembly, and guidelines for PCB design and rework, and package performance information (such as Moisture Sensitivity Level rating, board level reliability, mechanical and thermal resistance data).

It contains generic information for various Freescale QFN and DFN packages assembled internally (or at external subcontractors). Specific information about each device is not provided. To develop a specific solution, actual experience and development efforts are required to optimise the assembly process and application design per individual device requirements, industry standards (such as IPC and JEDEC), and prevalent practices in the assembly environment.

View the PDF document for more information.

Originally published by Freescale Semiconductor at www.freescale.com as "Assembly Guidelines for QFN and DFN Packages".





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