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PCB design guidelines for 0.4mm and 0.5mm WLPs

Posted: 06 Nov 2013     Print Version  Bookmark and Share

Keywords:printed circuit board  PCB  waferlevel package  WLP 

When designing a system-level circuit, printed circuit board (PCB) real estate can come at a premium. One method of reducing a design's required PCB area is to use a smaller IC package, such as a waferlevel package (WLP). This can free up a lot of area on your PCB and can also save you in cost, if you plan accordingly.

WLPs are much smaller than their predecessors because the package is built up directly on the silicon substrate and no bond wires are used. This in turn saves cycle time and packaging costs. However, to keep PCB costs at a minimum, some layout considerations need to be taken. This tutorial will present some general PCB layout guidelines to follow when using WLPs. These guidelines are provided as an aid for developing a PCB layout design to increase the chance that your design can be reliably manufactured.

View the PDF document for more information.

Originally published by Maxim Integrated Products as "PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs".

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