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Guide to MEMS inertial sensor soldering

Posted: 28 Oct 2013     Print Version  Bookmark and Share

Keywords:MEMS  inertial sensors  printed circuit board  PCB  mounting 

MEMS inertial sensors can be sensitive to printed circuit board (PCB) design and PCB mounting processes such as reflow. Reducing stresses on a MEMS package can help ensure the best performance for the entire inertial sensing application.

This application note contains guidelines for the layout, soldering, and mounting of MEMS inertial sensors, such as those in accelerometers and gyroscopes, in a land grid array (LGA) package.

This document provides recommendations based on typical circuit board manufacturing parameters. However, since land pattern design depends on many unknown factors (e.g., the user's board manufacturing specs), the user needs to determine the suitability of the guidelines for a particular case.

View the PDF document for more information.

Originally published by Maxim Integrated Products as "Soldering Guidelines for MEMS Inertial Sensors".

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