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FastSPICE simulator boasts up to 10X throughput

Posted: 11 Oct 2013     Print Version  Bookmark and Share

Keywords:chip design  simulator  IR  timing 

Cadence Design Systems Inc. has announced what it touts as a high-performance FastSPICE simulator that enables faster and more comprehensive simulation for large, complex chip designs. The Spectre XPS (eXtensive Partitioning Simulator) simulator promises to deliver ground-breaking partitioning technology that brings up to 10 times faster throughput compared to similar products, shortening simulation from weeks to days.

According to the firm, Spectre XPS uniquely enables designers to accurately measure timing while including the impact of IR drop, making it ideal for advanced-node, low-power mobile designs, where high performance, accuracy and a greater capacity for post-layout verification are imperatives.

Built on the Cadence Spectre simulation platform, Spectre XPS allows the easy re-use of models, stimulus, analysis and overall methodology, thereby reducing support costs while improving time to production. The unified Spectre simulation platform spans SPICE, advanced SPICE, RF and FastSPICE, enabling easy transition across analysis and flows. Spectre XPS integrates into the Virtuoso Analog Design Environment for mixed-signal design, and into the Liberate MX memory characterisation tool for SRAM characterisation.

The faster throughput of Spectre XPS lets design teams conduct more thorough and accurate simulations for large memory-intensive designs, as well as low-power architectures that require greater visibility into parasitics. In addition to improvements in throughput, the simulator requires two to three times less system memory than competitive offerings, improving compute resources utilisation.

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