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USB 3.1 specification announced

Posted: 05 Aug 2013     Print Version  Bookmark and Share

Keywords:USB 3.0 Promoter Group  USB 3.1  SuperSpeed 

The USB 3.0 Promoter Group said that it has completed the USB 3.1 Specification. The new spec adds enhancements to enable SuperSpeed USB to operate at up to 10 Gbps.

"SuperSpeed USB 10Gbit/s uses a more efficient data encoding and will deliver more than twice the effective data through-put performance of existing SuperSpeed USB over enhanced, fully backward compatible USB connectors and cables. Compatibility is assured with existing USB 3.0 software stacks and device class protocols as well as with existing 5Gbit/s hubs and devices and USB 2.0 products," the Group said.

USB 3.0 can offer transfer speeds of up to 5Gbit/s. Just like the USB 3.0 standard, the USB 3.1 SuperSpeed standard will be backwards-compatible with devices based on USB 2.0.

"The USB 3.1 specification primarily extends existing USB 3.0 protocol and hub operation for speed scaling along with defining the next higher physical layer speed as 10Gbit/s," said Brad Saunders, USB 3.0 Promoter Group Chairman. "The specification team worked hard to make sure that the changes made to support higher speeds were limited and remained consistent with existing USB 3.0 architecture to ease product development."

Chip makers like Intel can now start work on chips that support the new USB 3.1 specification.

"The industry has affirmed the strong demand for higher through-put, for user-connected peripherals and docks, by coming together to produce a quality SuperSpeed USB 10Gbit/s specification," said Alex Peleg, Vice President, Intel Architecture Group. "Intel is fully committed to deliver on this request."

"While maintaining backward compatibility, USB continues to advance to meet customer's growing need for higher speed data," said Roland Sperlich, TI Consumer and Computing Interface Product Line Manager. "The 10Gbit/s data rate allows designers across many industries to do more with a universal standard."

"In this multi-device world, the USB 3.1 updates will enable end-users to move content across devices quickly, conveniently and without worrying about compatibility," said Emile Ianni, Corporate Vice President of Platform Solutions Engineering, AMD. "AMD thanks our engineers as well as the other technology contributors for bringing to market robust innovation that is designed to work seamlessly with new and existing solutions."

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