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Schottky diodes boast two-fold power density

Posted: 08 Jul 2013     Print Version  Bookmark and Share

Keywords:Diodes  Schottky diode  SDM0230CSP  smartphone  tablet 

Diodes Inc. has unleashed the 30V, 0.2A SDM0230CSP Schottky diode available in the X3-WLCUS0603-3 solder pad package. Featuring a typical thermal resistance of 261ºC/W, the device claims to improve smartphone and tablet designs by offering an alternative to miniature DFN0603 devices that boast twice the power density for the same PCB footprint, indicated the company.

Using 70 per cent less board space than the industry-standard DFN1006 and SOD923 packaged Schottkys, the 0.18mm footprint SDM0230CSP is also aimed at high-density design, continued Diodes. Additionally, its 0.3mm off-board profile is 25 percent thinner, benefiting ultra-thin portable products.

The Schottky’s low maximum forward voltage of just 0.5V for a forward current of 0.2A, combined with a typical low leakage current of only 1.5mA at a reverse voltage of 30V, means it cuts power losses, thus extending battery life.

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