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New consortium for 2.5 Through-Silicon Interposer

Posted: 26 Jun 2013     Print Version  Bookmark and Share

Keywords:A*STAR Institute of Microelectronics  2.5D Through-Silicon Interposer  3D-memory  wafers  Synopsys 

A*STAR Institute of Microelectronics (IME) has formed the 2.5D Through-Silicon Interposer (TSI) Consortium to accelerate market adoption of TSI technology, which is driven by strong demands in computer infrastructure and consumer electronics.

The consortium aims to deliver a high-performance functional 2.5D IC, a form of 3D-IC integration, test vehicle to demonstrate and optimise integration of logic and 3D-memory, integrated passive devices (IPD) and dense interconnects on TSI. It targets low power and high performance requirements of networking, graphics and mobile application processors. At the same time, the fabrication and assembly of the interposers on 300mm wafers will support volume production at low cost, IME said in a statement.

Members of the consortium include United Microelectronics Corporation (Singapore Branch), Synopsys, eSilicon Corporation, EV Group, KMG Ultra Pure Chemicals Pte. Ltd, Tezzaron Semiconductor Corporation, and United Test and Assembly Center Ltd.

“The consortium brings members of the supply chain together to address challenges such as heat management, reliability analysis and packaging.”

IME will provide its onsite 300mm wafer fabrication resources and assembly process capability while consortium members will bring their market expertise on performance, design and manufacturing requirements.

Yole Développement analysts expect that over 20 lakh 300mm wafers will be produced in 2017 and the 2.5D interposer substrate will impact more than 16 per cent of the traditionally ‘organic-made’ IC package substrate business by 2017, with almost Rs.8,695.65 crore ($1.6 billion) revenues generated by then.

“The strategic alliance between fabless companies, technology and EDA providers, foundry, assembly and test providers, materials and equipment vendors, in which each represents a vital segment of the manufacturing ecosystem, will advance the market adoption of 2.5D integration for a wide range of applications,” said Prof. Dim-Lee Kwong, executive director of A*STAR IME.

“Integrating 2.5D systems with TSI technology offers many potential benefits to electronics companies, such as higher performance and lower power,” said John Chilton, senior vice president of marketing and strategic development, Synopsys. “Along with IME and other members of the 2.5D TSI consortium, we are aiming to accelerate the design, as well as improve the cost and reliability, of 2.5D integrated systems. We look forward to jointly delivering practical research results that can enable designers to rapidly create innovative 2.5D systems using TSI technology.”

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