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TO-leadless package supports apps up to 300A

Posted: 16 May 2013     Print Version  Bookmark and Share

Keywords:Infineon Technologies  OptiMOS  MOSFET  TO-leadless 

Infineon Technologies AG has debuted the TO-leadless package that delivers reduced package resistance, significantly smaller size as well as improved EMI behavior. According to the company, it contains the latest OptiMOS MOSFET generation for applications with high power and reliability requirements such as forklift, light electric vehicles, eFuse, PoL (point of load) and telecom systems.

The TO-leadless package has been designed for high currents up to 300A. Due to its low package resistance it enables the lowest RDS(on) in all voltage classes. The 60 percent smaller package size compared to D2PAK 7pin enables a very compact design, boasted the company. TO-leadless shows a substantial reduction in footprint of 30 percent and requires less board space for example in forklift applications. The 50 percent reduced height offers a significant advantage in compact applications such as rack or blade servers. Moreover low package parasitic inductances result in an improved EMI behavior.

In addition, TO-leadless comes with a 50 percent bigger solder contact area that leads to lower current density, noted Infineon. This helps to avoid electro migration at high current levels and temperatures, resulting in improved reliability. Unlike other leadless packages TO-leadless offers an optical inspection due to tin plated grooved leads.

The package is the best choice for high power applications where highest efficiency, superior reliability, best EMI behavior as well as best thermal behavior are required.

Samples of TO-leadless are available in 30V (0.4mΩ max.), 60V (0.75mΩ max.), 100V (2mΩ max.) and 150V (5.9mΩ max.) with production devices available in 3Q13.

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