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Teardown: Inside Samsung Galaxy S4

Posted: 02 May 2013     Print Version  Bookmark and Share

Keywords:smartphone  Android  Galaxy S4 

Broadcom NFC chip
Broadcom doesn't stop there though. The Samsung Galaxy S4 is also the first appearance of Broadcom's newest NFC IC, the BCM20794. We had previously seen use of the BCM20793 in the Samsung Google Nexus 10 tablet. Broadcom also provides the GPS receiver with the BCM47521 securing three major socket wins for the California-based company.

The first appearance of Broadcom's newest NFC IC, the BCM20794

The first appearance of Broadcom's newest NFC IC, the BCM20794.

Other notable design wins include Maxim's MAX77803 providing further power management, Wolfson Micro's WM5102 providing the audio codec, and Atmel's UC128L5-U as the 32bit microcontroller with 128KB of flash. Keep checking back here to see what other devices we uncover as we continue our decap process on the components inside.

In our teardown of the Galaxy S3, what we discovered is that Samsung used their flagship handset to introduce new technologies with their IC designs. Not only did the S3 introduce a new processor, but also a new process node in the corresponding DRAM memory. Much like the S3, the I9500 model of the Galaxy S4 features a new processor, but also a new form of processor memory. Paired with the Exynos 5410 Octa, is a new low-power DDR3 DRAM (LPDDR3) device from Samsung. With the package marking of K3QF2F200C-XGCE, decapping the device reveals the K4E4E324EB die, which corresponds to Samsung LPDDR3 memory.

Die marking on Samsung's LPDDR3 memory chip

Die marking on Samsung's LPDDR3 memory chip.

Much has been written about the performance of Samsung's newest Exynos processor and its eight-core design. Benchmark tests from other sites have shown that Samsung has been able to back their claims of developing one of the best mobile application processors on the market.

Die marking of the Samsung Exynos 5410 Octa

Die marking of the Samsung Exynos 5410 Octa.


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