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MonolithIC awarded 30th 3D IC patent

Posted: 18 Mar 2013     Print Version  Bookmark and Share

Keywords:3D IC  TSV  through-silicon via  3D technology  monolithic 3D 

Silicon Valley startup MonolithIC 3D Inc. has been awarded four more new patents in 3D IC technology, bringing up the company's patent count to 30. The company currently has 26 issued patents and still has 50 pending patents, making the firm one of the major players in the 3D IC field.

Monolithic 3D IC technology provides IC designers and manufacturers 10,000x higher vertical connectivity than state-of-the-art Through-Silicon Via (TSV) 3D technology. You can find the complete list of the company's issued patents and details about the innovative technology it provides on its website.

MonolithIC's 3D technology is based on monocrystalline technology, which offers an even better foundation for this emerging new trend, the company noted. In addition, the monolithic 3D technology empowers older wafer fabs to offer competitive new products and could offer advanced fabs a longer effective manufacturing road map with the same design tools. An extremely powerful and unique advantage of monolithic 3D is the option to process multiple layers in parallel following one lithography step. A detailed discussion of the monolithic 3D IC advantages—the "3D IC Edge" was posted recently on the company's website.

The MonolithIC 3D IP portfolio covers logic devices, memory devices such as NV NAND R-RAM and DRAM, and electro-optic derivatives such as micro-displays and multi-spectrum imaging with pixel electronics. Further, the company was granted broad coverage for its wafer-scale-integration technology.

"We are very pleased with the depth and the broadness of our granted patents. We understand that monolithic 3D IC is a disruptive technology and was considered until recently as impractical. We believe that has changed and we hope to help drive this technology forward" said Zvi Or-Bach, President and CEO of MonolithIC 3D Inc. "Our patent portfolio now also covers heat removal from 3D ICs (for example, US patent 8,373,230). The results of some of our heat removal features were recently presented at IEDM, in collaboration with Stanford University."

"By bringing a practical monolithic 3D technology, we believe that the industry could return to the aggressive scaling trend we had, until recently, enjoyed—the powerful combination of reductions in cost, decreases in power consumption, and improvements in performance, plus produce some new and compelling benefits such as logic redundancy and heterogeneous integration," said Brian Cronquist, vice president of technology & IP at MonolithIC 3D.

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