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Solder reflow guidelines for Pb-Free packages

Posted: 28 Dec 2012     Print Version  Bookmark and Share

Keywords:Pb  hazardous substances  electronics industry 

Recent legislative directives and corporate driven initiatives around the globe have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of the electronics industry. The Pb-free program at Xilinx was established in 1999 as a proactive effort to develop and qualify suitable material sets and processes for Pb-free applications. Xilinx has taken the leadership position by quickly forming partnerships with our customers, suppliers, and participating in industry consortiums to provide technical solutions that are aligned with industry requirements.

Xilinx has researched alternatives for Pb compounds and has selected matte Sn lead finish for lead-frame packages and SnAgCu solder balls for BGA packages. In addition, suitable material sets have been chosen and qualified for higher reflow temperatures (245°C–260°C) that are required by Pb-free soldering processes. Pb-free products from Xilinx are designated with an additional "G" in the package designator portion of the part number.

For reflow soldering applications, SnAgCu solder has been chosen by the industry as the most viable Pb-free solder to replace eutectic Sn/Pb solder. Compared with other Pb-free alloys, SnAgCu has better characteristics in terms of cost and processability as well as comparable or better reliability than eutectic Sn/Pb solder. However, SnAgCu alloy has a much higher melting temperature (217°C) than the standard eutectic Sn/Pb solder. Thus, assembly processes must be optimised accordingly to achieve the best yields and reliability.

This document contains guidelines on reflow soldering, inspection, and rework process for Pb-free packages.

View the PDF document for more information.

Originally published by Xilinx Inc. at as "Implementation and Solder Reflow Guidelines for Pb-Free Packages".

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