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MOSFETs tout exposed-top packaging to keep cool

Posted: 22 Oct 2012     Print Version  Bookmark and Share

Keywords:MOSFET  power  exposed source  heat slug 

Alpha and Omega Semiconductor Ltd introduces discrete power MOSFETs that use the company's exposed-source XSFET technology.

A patent-pending packaging technology, the bottom of the package of the XSFET is the "source," which enables power designers to remove heat more effectively to PCB ground plane. It has a top heat slug that can be "top-exposed" or "non top-exposed" depending upon design criteria. The top-exposed version increases heat transfer, cutting power loss by keeping the die cooler.

The XSFET offers standard lead-frame based board mounting in a fully encapsulated DFN moulded package, minimising thermal discrepancy between the device and the PCB while offering near zero parasitic inductance with its layout friendly footprint.

Aside from the exposed source packaging, the 30V N-channel AOE6580 and AOE6580T (with top-exposed option) use the company's 30V AlphaMOS silicon technology. They are said to be optimised for high performance demanding motor control, OR'ing, and E-fuse applications. They offer 0.95mΩ max @10VGS Rds(on) making them suited for power supplies in computing, telecom, and high power density point-of-load sockets.

The AOE6770T and AOE6772T offer very high efficiency in server and high-end notebook applications by combining 25V AlphaMOS silicon technology and exposed-source packaging technology with the top-exposed option in industry standard DFN5x6 footprint.

Completing the company's offerings, the AOE7770T is a high-side MOSFET that combines exposed-source technology in compact DFN3x3 footprint with top-exposed option.

The AOE6770T, AOE6772T, AOE7770T, AOE6580, and AOE6580T are in halogen-free DFN packages and are MSL1 rated. They are all 100 per cent UIS and Rg tested.





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