Global Sources
EE Times-India
Stay in touch with EE Times India
EE Times-India > RF/Microwave

FEMs offer QFN packaging for cellular handsets

Posted: 24 Jul 2012     Print Version  Bookmark and Share

Keywords:GSM  front-end-module  FEM  cellular 

RDA Microelectronics rolls the RDA6641 and RDA6651 Quad Flat No-lead (QFN) packaged GSM Front-End-Modules (FEM) for quad-band cellular handsets. The devices, said to be the first such QFN solution, uses the company's integrated passive device (IPD) technology to target the cost-sensitive GSM mobile market.

The RDA6641 and RDA6651 are packaged in 5mm x 5mm x 0.75mm form factors with pin mappings designed for compatibility with previous RDA products, such as the RDA6625 and RDA6635. These QFN packaged GSM FEMs integrate quad-band power amplifiers and antenna switches for cost competitive advantages compared to traditional LGA packaged solutions while providing almost identical RF performance. Both devices have passed all of the strict reliability and life tests required for mobile handset applications.

Comment on "FEMs offer QFN packaging for cellula..."
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.


Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top