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A new technique cools electronic devices 25% faster

Posted: 12 Apr 2012     Print Version  Bookmark and Share

Keywords:grapheme  copper  indium-graphene 

A North Carolina State University researcher claims to have developed a more efficient, less expensive way of cooling electronic devices – particularly devices that generate a lot of heat, such as lasers and power devices.

By fabricated heat spreaders from a unique copper-graphene composite and connecting it to microchips using an indium-graphene interface film, heat is dissipated 25 per cent faster than with the pure copper heat spreaders used today. The techniques is also cheaper to produce, since it uses less copper that conventional heat spreaders, and will be particularly useful for electronic devices that generate a lot of heat, such as lasers and power semiconductors.

"Both the copper-graphene and indium-graphene have higher thermal conductivity, allowing the device to cool efficiently," said Jag Kasichainula, an associate professor of materials science and engineering at NC State.

According to him, the copper-graphene composite can be deposited in films as thin as 200 microns, according to the effective medium approximation (EMA) method of modelling thermal conductivity and determining the interfacial thermal conductance between copper and graphene.

Kasichainula has also created a blueprint for manufacturers wishing to quickly retool for fabrication of the graphene-copper heat spreader using an electrochemical deposition process.

- R. Colin Johnson
  EE Times

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