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Hybrid CMOS image sensor sol'n ups resolution

Posted: 20 Mar 2012     Print Version  Bookmark and Share

Keywords:CMOS image sensor  3D imaging  security sensor 

TowerJazz Inc. unveils the TS11IS hybrid CMOS image sensor (CIS) platform that combines the company's 0.16µm CMOS for periphery circuits and its 0.11µm pushed design rules for the pixel array, allowing the development of higher resolution high-end sensors with smaller pixels and enhanced performance in applications such as high end photography, machine vision, 3D imaging and security sensors.

The platform will allow easy reuse of existing customers' 0.18µm circuit IP that will save them from investing in resources to redesign existing blocks, and increase the probability for first time success, according to TowerJazz. The TS11IS offers improved pixel performance, smaller pixel pitch, higher resolution, improved sensitivity and improved angular response, added the company.

It allows up to 50 per cent reduction of pixel size, mainly for high-end global shutter pixels. The platform includes a new local interconnect layer to allow denser metallisation routing in pixels while maintaining good quantum efficiency. It also includes tighter design rules for all metal layers and implant layers as well as provides a "Bathtub" option for lower stack height, improving the sensors' angular response.

The hybrid CIS process platform will be offered for prototyping for select customers in Q3 12, and for production towards the end of the year.

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