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Synopsys, Applied Materials to develop new TCAD models

Posted: 19 Mar 2012     Print Version  Bookmark and Share

Keywords:TCAD  chip technologies  front-end-of-line  back-end-of-line 

Synopsys and Applied Materials will jointly develop technology computer-aided design (TCAD) models for next-generation semiconductor devices.

The models derived from this collaboration will enable customers to speed up process development for 14nm and 11nm logic and new memory chip technologies, according to Synopsys.

The collaboration encompasses front-end-of-line (FEOL) processing, including process, topography and device simulation, back-end-of-line (BEOL) reliability, including interconnect simulation.

In this collaboration, Applied Materials will supply critical film properties and device characterisation data from its advanced process systems to Synopsys, thereby enabling the development of models using Synopsys' Sentaurus TCAD tool suite.

The Synopsys TCAD tools help to reduce the number of engineering wafers needed to develop new technologies, acting both as a prototyping tool to explore new device architectures before a process is defined and as an engineering tool for process integration and optimisation.

"TCAD modelling has been essential for the development of 3D FinFET and memory technologies," said Howard Ko, senior vice president and general manager, Silicon Engineering Group, Synopsys.

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