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Tower bids for chip fab in India

Posted: 17 Feb 2012     Print Version  Bookmark and Share

Keywords:chip fab  MoU  bid  analogue technology 

Israel-based foundry chipmaker Tower Semiconductor Ltd, which operates under the brand name TowerJazz, has signed a binding MoU with an Indian infrastructure conglomerate to build and operate a 300mm chip facility in India. The name of the Indian partner is not yet disclosed.

According to reports, Tower will not invest money in this project, and will just provide the know-how.

This move will enable the company to develop 300mm wafer size, 90nm analogue technology and companion chips in deep sub-micron technologies (65-45nm), Tower said.

A 3-way consortia, including Tower, the Indian company and a "worldwide leading technology provider" (as described by Tower), has presented to the empowered government committee.

"We are in the best position, as the consortium is very strong and TowerJazz has an impeccable reputation in India based on a previous successful government fab project win and execution," Tower said in its press release. "However, we cannot predict the outcome of government selection, and hence cannot give assurance that we will win this bid."

Amir Elstein, chairman, Tower, stated, "In only a few years, the company has cemented a substantial lead as the speciality foundry market leader, with strategic tier one customers in high growth, high margin analogue segments. The recently signed India MoU is a tremendous opportunity for TowerJazz to utilise its manufacturing knowhow and technical expertise to gain a low cost entrance into an emerging market at a 300mm wafer size level. Should this proposal not be accepted, we remain active in pursuing such models where we add benefit to our partners and customers through our expertise and execution and benefit to the shareholders through profitable upside growth."

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