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Dual supply voltage MCUs debut in 2x2mm package

Posted: 16 Feb 2012     Print Version  Bookmark and Share

Keywords:mcu  microcontroller  ARM  cortex m10 

NXP Semiconductors N.V. debuts the LPC1100LV series touted as the first ARM Cortex-M0 microcontroller with dual supply voltage of 1.65V to 1.95V VDD and 1.65V to 3.6V VIO targeted at battery-powered end applications ranging from mobile phones, tablets, Ultrabooks and mobile accessories to active cable, cameras, and portable medical electronics.


The LPC1100LV series offers 50 MIPS performance in a tiny 2mm x 2mm footprint.

The LPC1100LV series offers 50 MIPS performance in a tiny 2mm x 2mm footprint with over three times power reduction compared to similar 3.3V VDD devices, according to NXP.

Based on NXP's latest proprietary embedded Flash with 256B erase sector and low leakage current, the LPC1100LV can handle linear current consumption at low clock frequency while reducing system power. For example, in a mobile system such as a smartphone, most system components are expected to remain mostly in sleep mode with very low current consumption. When a device is needed, fast wake-up and peak performance must be reached in a short amount of time. The LPC1100LV meets this demand with a 5µs wake-up time.

The LPC1100LV devices deliver 50 MIPS of performance compared to the 1 to 5 MIPS performance typical of 8/16bit MCUs. This high performance allows LPC1100LV to complete demanding tasks faster and to remain in active mode for a shorter period of time, further reducing the average current consumed by the device. Given the same task, LPC1100LV's unique 1.65V-1.95V VDD low-voltage input offers more than three times power reduction compared to competitor Cortex-M0 devices using 3.3V VDD input, and more than ten times compared to typical 8/16bit MCUs. Sub-systems that can take special advantage of the LPC1100LV's MIPS performance include system security and authentication (including handling AES-256 encryption), system interface and controls (such as keypads and touchscreens), system peripheral controls (for audio and lighting), and for running software stacks (such as Bluetooth Low Energy radio).

The LPC1100LV is available in NXP's tiny 2mm x 2mm Chip-Scale Package (WLCSP) claimed to be the world's smallest 32bit MCUs. Also available in a 5mm x 5mm HVQFN package and offering 1.8V VDD and 3.3V VIO dual voltage inputs for CPU and I/O, this option offers a unique level-shifting capability between SSP/SPI (3.3V) and I2C (1.8V). NXP is also offering customised combinations of SRAM, Flash and package for high-volume customers.

Other specifications for the LPC1100LV devices include:
 • Cortex-M0 CPU up to 50MHz.
 • 1.6µA deep sleep current and 5µs wake-up time.
 • Up to 8KB SRAM and 32KB FLASH.
 • SPI, UART and I2C.
 • Up to 10bit, 8-channel ADC with 400ksps.
 • Two 32bit Timers and two 16bit Timers.
 • 12MHz oscillator at 1 per cent accuracy.
 • WL-CSP25, HVQFN24 and HVQFN33 package options (BGA available).

Samples are available today for lead customers.

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