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CEA-Leti showcases 22nm maskless lithography

Posted: 15 Feb 2012     Print Version  Bookmark and Share

Keywords:Lithography  10nm logic processing nodes  wafer 

CEA-Leti, the French Research and Technology Institute, said that 22nm lines and spaces have been created using direct-write e-beam lithography technology. The demonstrated resolution meets the requirements for both 14nm and 10nm logic processing nodes.

In addition, Mapper Lithography BV (Delft, The Netherlands), the developer of the multibeam prototype lithography machine in use at CEA-Leti (Grenoble, France) and CEA-Leti have announced the extension of a collaborative R&D programme called Imagine for an additional three years. This will include the installation of the first Matrix pre-production tools at CEA-Leti.

Mapper's pre-alpha platform has been installed in CEA-Leti's cleanroom since mid-2009. Both STMicroelectronics and Taiwan Semiconductor Manufacturing Co. Ltd. were participants in the original Imagine program and 50 representatives from 13 companies participated in an operational review of the research conducted in January 2012.

ST and TSMC plus Mapper, Nissan Chemical, TOK, Dow, JSR Micro, Synopsys, Mentor Graphics, Sokudo, Tokyo Electron and Aselta are participating in the project with the goal of offering maskless lithography in a commercial manufacturing environment.

"In 2012, Mapper will complete its Matrix pre-production platform with initially a 1 wafer per hour throughput capability and scalable to 10 wafers per hour," said Bert Jan Kampherbeek, CEO of Mapper, in a statement issued by CEA-Leti.

Laurent Malier, CEA-Leti CEO, said: "By continuing the Imagine programme for another three years, we will continue to answer to the increasing interest showed by industry."

- Peter Clarke
  EE Times





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