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Samsung eMCPs target mid-level smartphones

Posted: 23 Jan 2012     Print Version  Bookmark and Share

Keywords:embedded  multi-chip package  eMCP  memory  DRAM 

Samsung Electronics Co. Ltd rolls a line of embedded multi-chip package (eMCP) memory designed entry- to mid-level smartphones. The solutions come in a wide range of densities, using low power DDR2 DRAM made with 30nm process technology and NAND flash memory using 20nm technology. They aim to meet the need for advanced software and increased data storage in smartphones and tablets.

The company claims the eMCP memory solutions will provide engineers with a simple design process deliver better performance and longer battery life than current solutions.

The eMCP solutions come in packages that consist of a 4GB embedded MMC based on 20nm-class NAND flash memory for data storage, and a choice of 256-, 512- or 768MB of 30nm-class LPDDR2 DRAM for supporting high-performance mobile device systems. (Each is equivalent to 2Gb, 4Gb and 6Gb, respectively.)

The 30nm-class LPDDR2 DRAM chip achieves data transmission speed of 1,066Mbps, double the performance of the industry's previous mobile DRAM. It is also claimed to increase performance by about 30 per cent using 25 per cent less power compared to currently available 40nm-class LPDDR2 DRAM. Also, applying the 30nm-class process technology is said to improve chip manufacturing productivity by 60 per cent over 40nm-class technology.

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