Routing DM816xx CYG package

Texas Instruments' DM816xx CYG package is designed with a technology called a Via Channel array. This technology is touted to allow easy routing of the device in two signal and two power layers using large through-hole via diameters and standard trace widths. Where more than four printed circuit board (PCB) layers are used, the routing is much more open and flexible than a regular BGA. This application report shows how to route the entire package by showing each quadrant up close and explaining the PCB feature sizes used. For this document, the Allegro layout tool was used, although any PCB layout tool can be used.

View the PDF document for more information.

Originally published by Texas Instruments at www.ti.com as "DM816xx Easy CYG Package PCB Escape Routing".