Global Sources
EE Times-India
EE Times-India > EDA/IP

Routing DM816xx CYG package

Posted: 22 Dec 2011     Print Version  Bookmark and Share

Keywords:printed circuit board  layout tool  routing 

Texas Instruments' DM816xx CYG package is designed with a technology called a Via Channel array. This technology is touted to allow easy routing of the device in two signal and two power layers using large through-hole via diameters and standard trace widths. Where more than four printed circuit board (PCB) layers are used, the routing is much more open and flexible than a regular BGA. This application report shows how to route the entire package by showing each quadrant up close and explaining the PCB feature sizes used. For this document, the Allegro layout tool was used, although any PCB layout tool can be used.

View the PDF document for more information.

Originally published by Texas Instruments at as "DM816xx Easy CYG Package PCB Escape Routing".

Comment on "Routing DM816xx CYG package"
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.


Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top