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LIN transceivers save 75% PCB area

Posted: 14 Sep 2011     Print Version  Bookmark and Share

Keywords:transceivers  LIN  DFN 

Atmel Corp. launches ATA6670 and ATA6663, single and dual LIN transceivers offering small packaging and wettable flanks to enable overall lower system cost.

Compared to standard SO8 packages at 5mmx6.5mm, the DFN14 package for the ATA6670 measures at 3mmx4.5mm, while the DFN8 package for the ATA6663 measures at 3mmx3mm, saving about 75 per cent of the overall PCB area. Space and cost savings are critical for LIN bus networking applications such as automotive body electronic systems, including door modules, seat control, intelligent sensors or powertrain applications. Since both DFN packages are pin-compatible, either single- or dual-LIN transceiver can be used on the same PCB design.

LIN DFN packages with wettable flanks enable the use of automated optical inspection (AOI) tools during final quality tests, which eliminate X-ray inspections to avoid cost-intensive tool investments. In addition, the wettable flanks enable improved soldering performance for temperature cycling.

The new LIN devices are manufactured using Atmel's high-voltage BCD-on-SOI process, also known as SMART-I.S. technology, which is optimised for operations up to 40V for applications in harsh automotive environments. The results of manufacturing on the SMART-I.S. technology is EMC robustness (EMC test and conformance test LIN2.1, Europe, and SAE J2602-2, US), and ESD protection (exceeding 6kV).

Samples of the ATA6670 and the ATA6663 are now available with prices starting at Rs.20.18 ($0.45) (ATA6663) and Rs.40.36 ($0.90) (ATA6670) for 10,000 pieces orders. To simplify and speed-up design-ins, evaluation kits for both devices are on offer at Rs.2,242.15 ($50).

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