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EE Times-India > EDA/IP

3D IC opens new doors for the wireless market

Posted: 20 Jun 2011     Print Version  Bookmark and Share

Keywords:mobile devices  mixed-signal SoCs 

Today's mobile devices offer almost everything at the palm of your hand, with the touch of a button—from Internet browsing and e-mail to watching high-definition TV or using a GPS. The growing demand for multimedia features translates into complex design requirements, such as higher performance with reduced power in an ever-smaller footprint.

Design teams have two choices: either shrink the node or innovate some alternative to address the "more than Moore" trend. With development costs heading towards $100 million for the 32nm process node, for example, monolithic mixed-signal SoCs are increasingly challenging and time-consuming to develop.

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