TSMC collaborates with Sematech for IC process tech

Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) becomes a core member of Semiconductor Manufacturing Technology (Sematech) to drive R&D efforts for IC process technologies for the 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to the 450mm wafer size for production..

TSMC in Hsinchu, Taiwan, has long been a core member at a rival research collaboration, hosted by IMEC in Leuven, Belgium, where it works with most of the world's leading semiconductor companies. The company has now opted to also join Sematech.

Sematech's other core members include GlobalFoundries, Hewlett Packard, IBM, Intel, Samsung, UMC, and the College of Nanoscale Science and Engineering (CNSE) at Albany, New York.

"This complementary cooperation leverages Sematech's collaborative approach to lead critical industry technology transitions, with TSMC's position as an industry leader in advanced technology development and manufacturing," says Jack Sun, CTO at TSMC.

"TSMC will be an important partner in accelerating the progress of R&D innovations and manufacturing solutions in leading edge technologies," said Dan Armbrust, president and CEO of Sematech.

- Peter Clarke
  EE Times