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RF amplifiers claim ultra-small package size

Posted: 17 May 2011     Print Version  Bookmark and Share

Keywords:rf amplifier  chip scale  vmmk 

Avago Technologies debuts the VMMK-3xxx amplifiers with a 1x0.5x0.25mm ultra-small footprint offering functionalities such as a positive gain slope low-noise amplifier (LNA), a wideband LNA, a variable gain amplifier (VGA), and four directional detectors.

Based on the Avago WaferCap chip scale packaging (CSP) technology with miniature 0402 package dimensions and no wirebonds, the VMMK-3xxx amplifiers experience almost no signal loss and minimal parasitics. The devices take up 5 per cent of the volume and uses only 10 per cent of the board area of solutions using a standard SOT-343 package. In some cases, the miniature amplifiers can effectively reduce PCB area by more than 50 per cent. The ultra-small package size and fully-matched surface mount design are optimised for 500MHz to 12GHz frequencies targeted at a variety of radio architectures and space-constrained applications. The VMMK-3xxx LNAs and VGA can be used in UWB, WLAN, WiMAX, generic IF amp and gain block applications, while the new detectors can be used in base stations, point-to-point radios and generic power control loop detectors, as well as for monitoring power amplifier output.

The VMMK-3xxx family supports full surface mount capability, requiring no special tooling for assembly. The amplifiers have all I/Os routed to the backside of the device wafer through via-holes. This is a significant improvement over conventional plastic packages where bond-wires exhibit substantial parasitics that limit the operating frequency. The miniature amplifier family provides high gain, a high third-order intercept point (IP3) for good linearity, low noise figure (NF) and integrated 50Ω input and output matching networks to simplify system design.

Samples and production quantities of VMMK-3xxx amplifiers are available now through Avago's direct sales channel and worldwide distribution partners.

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