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Sensors/MEMS  

Single-IC sensor signal conditioner targets auto apps

Posted: 13 May 2011     Print Version  Bookmark and Share

Keywords:sensor  automotive  board space  system BOM 

ZMDI AG introduces the ZSSC3170, a single-chip sensor signal conditioner IC that combines a fast and precise sensor conditioning IC with a robust LIN transceiver designed for resistive bridge sensors targeting air-conditioning, level measurement, seat adjustment and other comfort applications in modern cars which require integrated LIN interface.

The ZSSC3170 is designed for direct 12V supply provided by the vehicle power system. It enables the development of a complete sensor application with a single IC and helps to save component costs and board space.

"The small size of the ZSSC3170 and the robust LIN interface help designers to reduce system space and cost," says Steve Ramdin, SSC product manager. "By the combination of LIN and sensor signal conditioning in one IC, only the sensor element and a few passive components are needed to develop a complete sensor application."

The integrated LIN transceiver meets the LIN specifications 1.3, 2.0 and 2.1. An EMC immunity of up to ±8kV of the LIN interface makes the ZSSC3170 ideal for the use in cars.

Since the ZSSC3170 is designed for harsh automotive environments, it incorporates special protection circuitry, excellent electromagnetic compatibility and numerous diagnostic features. It also offers an excellent EMC resistance. The device can be calibrated in-system where coefficients are stored in on-chip automotive-grade EEPROM. With ZMDI's single-pass calibration technique, no external trimming components are required. This feature further reduces the bill of materials and manufacturing costs.

The ZSSC3170 operates on supply voltages from 7 to 18V and over a temperature range of -40°C to +125°C, or extended up to 150°C. Accuracy is ±0.25 per cent FSO over a temperature range of -20°C to +85°C, ±0.50 per cent FSO at -40°C to 125°C and ±1 per cent FSO at -40°C to 150°C. The IC comes as die or in a SSOP20 package.





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