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Audio SoC supports up to 50W, cuts external heatsink

Posted: 11 May 2011     Print Version  Bookmark and Share

Keywords:audio IC  miniature device  audio system  audio gadgets 

STMicroelectronics debuts its Sound Terminal digital audio System-on-Chip (SoC), the STA350BW aimed at slimmer home audio designs that supports up to 50W of output power requiring no external heatsink.

Like other devices in the Sound Terminal family, the STA350BW has digital audio processing on the chip and features performance enhancing innovations such as Multiband Dynamic Range Compression (MDRC), which boosts audio clarity and system reliability. The SoC is also able to compensate non-ideal speaker characteristics. Enhancements introduced in this generation include optimised low-frequency response for outstanding bass performance. In addition, integrated protection features safeguard the system against a wide range of fault conditions. Run-time automatic diagnostic circuitry helps prevent failures and boosts the overall reliability of the application.

The IC's power stage uses ST's FFX technology to stream full digital audio to the speakers. This maximises flexibility for configurable products by providing four selectable run-time output configurations supporting a choice of operating modes including 2.0, 2.1 or 1.0 channel, or 2.0-channel with a PWM output for an external subwoofer.

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