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Boost analogue IC power dissipation with copper pillars

Posted: 07 Mar 2011     Print Version  Bookmark and Share

Keywords:Copper pillars  semiconductors  I/O interconnect 

What's old is new again: how often have we heard this saying or observed how technology can recreate itself and follow this saying? Copper pillars have been used for many years in flip chip or high-density semiconductors as a way to create higher-density I/O interconnect from the chip to the lead frame or even to the printed circuit board, in some cases.

The process is fairly simple. Grow a "pillar" of copper on top of the chip with the assistance of photo resist and properly controlled process techniques. Two benefits of using copper pillars are:
1. Better thermal resistance from the die to the lead frame vs traditional bond wires.
2. Lower interconnect resistance from the die to the lead frame vs traditional bond wires

Both of these offer big advantages when used in analogue circuits, especially those that need to conduct or control power.

View the PDF document for more information.





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