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Sematech, SRC, SIA drive 3-D chip standards

Posted: 10 Dec 2010     Print Version  Bookmark and Share

Keywords:3-D  chip standard  semiconductor design 

The International Consortium of semiconductor manufacturers, Sematech, along with Semiconductor Research Consortium (SRC) and Semiconductor Industry Association (SIA) are working out a programme to drive industry standardisation and the technical specifications for heterogeneous 3-D integration.

The new programme will be administered by Sematech's 3-D Interconnect programme in partnership with SRC and be based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

The programme aims to establish the infrastructure necessary for the industry to leverage 3-D packaging technology for new applications and will focus on establishing standards in inspection, metrology, microbumping, bonding and thin wafer and die handling.

To achieve this Sematech will partner with SRC to enable select university research projects.

"The 3-D Enablement programme has been established to bring down the barriers to integrating chips from different suppliers for adoption of 3-D technologies in high volume manufacturing," said Dan Armbrust, president and CEO of Sematech, in a statement.

While research on 3-D technologies has been ongoing for many years as witnessed by technical papers delivered at esteemed venues such as the International Electron Devices Meeting (IEDM) and the International Solid State Circuits Conference (ISSCC), 3-D has not yet made it to mainstream production due to lack of uniform standards and a limited understanding of key manufacturing parameters.

The programme will address industry infrastructure gaps in phases. First efforts will focus on developing the necessary standards and technical specifications, followed by planning activities to identify the key areas for developing design tools to support 3-D chip design.

Designed to meet the needs of diverse business models, the 3-D Enablement programme is open to international fabless, fab-lite and Integrated Device Manufacturers (IDM), outsourced assembly and test (OSAT) suppliers, and tool vendors.

- Nicolas Mokhoff
EE Times

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