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Siemens, NSC tie-up on advanced ultrasound equipment

Posted: 09 Sep 2010     Print Version  Bookmark and Share

Keywords:medical  ultrasound equipment  advanced imaging  Siemens  NSC tie-up 

Siemens Medical Solutions USA Inc. and National Semiconductor Corp. have launched a strategic tie-up to provide advanced medical ultrasound technology that offers energy-efficiency, low power consumption as well as enhanced image quality and advanced 3D/4D imaging capabilities.

The strategic alliance brings together Siemens experience in ultrasound technology with National's energy-efficient analogue semiconductor capabilities. National will provide efficient power management, signal path and transducer solutions while working closely with Siemens to create next-generation ultrasound imaging systems that offer workflow efficiency, diagnostic reliability and ease of scanning.

"For many years, we have been pushing the envelope to advance ultrasound imaging to the next level. Large data volumes and the increased demand for portability require systems with an effective balance between power efficiency and performance. We view National Semiconductor as a strategic analogue alliance to help us make this happen," said Dr. Norbert Gaus, CEO, clinical products division of Siemens Healthcare.

"This is an ideal alliance, which effectively leverages both companies' strengths. Already well known for its world-class healthcare solutions, Siemens' next-generation ultrasound systems will be enhanced by our high-performance technology, chipsets and sub-system-level solutions," said Mike Polacek, senior VP of key market segments and business development for National Semiconductor. "We are going to do great things together."

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