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WLAN power amplifier touts ultra-low-profile package

Posted: 24 Aug 2010     Print Version  Bookmark and Share

Keywords:power amplifier  WLAN  WiMax  WiBro  smartphone 

Microsemi Corp. rolls out the LX5514M power amplifier (PA) with a 1.5mm x 1.5 mm, 0.4mm-high footprint designed for use in space-constrained smartphones and other data-enabled cellular handset designs.

The LX5514M power amplifier supports IEEE 802.11b/g/n WLAN applications in the 2.4GHz to 2.5GHz frequency range. It complements Microsemi's recently introduced LX5553 and LX5543 front-end modules (FEMs). The new PA is based on the company's prior LX5514 PA, redesigned to fit into a compact, ultra-low-profile package. Like the previous LX5514, the new LX5514M offers fully matched input, simplified output matching, an integrated power detect function which saves board space and reduces the total BOM cost. Key features of the new LX5514M power amplifier include InGaP HBT process technology; 2.4 to 2.5GHz operation; single-polarity 3.3V supply, 80mA quiescent current; POUT of 19dBm, 3 per cent EVM; 27dB power gain, and 130mA total current.

Microsemi's portfolio of IEEE 802.11a/b/g/n WLAN, 802.16e WiMAX and WiBro PAs are adopted in a number of applications encompassing wireless access points and half mini-cards for notebooks and netbooks. Reference designs with WLAN chipset manufacturers are likewise available for many of Microsemi's power amplifiers.

The LX5514M is offered in a RoHS-compliant, dual flat no lead (DFN) package. Unit price is Rs.21.14 ($0.45) for 10,000-unit orders.

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