Global Sources
EE Times-India
Stay in touch with EE Times India
EE Times-India > RF/Microwave

WCDMA/HSPA+ PAs for smart phones, 3G devices

Posted: 13 Aug 2010     Print Version  Bookmark and Share

Keywords:power amplifier  WCDMA  HSPA+  3G  smart phone 

RF Micro Devices Inc. commences the high-volume production shipments of its RF720x WCDMA/HSPA+ power amplifiers (PAs) to leading smart phone and 3G device manufacturers in Korea and China. The RF720x product family is currently supporting multiple data-centric devices, and volume shipments are forecast to increase materially in calendar 2010.

The RF720x family of high-efficiency, linear PA modules is specifically designed for the needs of complex multi-band, multi-mode 3G mobile devices. Whether single- or dual-band, each PA is delivered in a compact 50Ω matched module optimised for their specific band of operation. By providing digital power mode states, the RF720x family allows for lower current consumption as power levels decrease. Additionally, each PA in the family features an integrated output power coupler, thereby eliminating the need to place discrete couplers externally—saving board space and bill-of-materials (BOM) cost.

RFMD's RF720x PAs maximise efficiency across all major 3G frequency bands (1-6, 8-11, 33, 34) to extend battery life in both voice and data operation. RFMD's RF720x PAs also feature a high mid-power to high-power switch point, enabling further improvement in efficiency and higher data throughput in mid-power data modes up to 19dBm.

The high mid-power switch point is especially critical to manufacturers of next-generation 3G/4G smart phones, as they seek greater reductions in output power in data-only operation. Also, by optimising all switch points (low-power, mid-power and high-power) for data-centric smart phones, the RF720x product family offers reduced customer test times related to calibration, further lowering total system costs while also accelerating time-to-market.

Eric Creviston, president of RFMD's Cellular Products Group (CPG), said, "RFMD's innovative new RF720x product family represents the next-generation of discrete 3G power amplifiers for smart phones and 3G devices. RFMD's RF720x product family helps smart phone manufacturers significantly enhance the consumer experience by extending battery life and enabling smaller device form factors. The RF720x product family also lowers our customers' total system costs and helps to maximise customer-level factory throughput by minimising design cycle times and test times. We are particularly excited about new smart phone programs we are supporting in Korea and China, and we look forward to ramping new design wins in the near-term in Europe and North America."

RFMD's RF720x product family includes nine high performance PAs designed for smartphones and 3G devices implementing mode-specific, band-specific front end architectures. The RF720x product family accommodates all major WCDMA/HSPA+/TD-SCDMA bands and band combinations and is optimised for seamless operation with reference designs from Qualcomm and other leading open market 3G chipset suppliers.

Comment on "WCDMA/HSPA+ PAs for smart phones..."
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.


Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top