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Multi-chip PRAM memory suits mobile handsets

Posted: 04 May 2010     Print Version  Bookmark and Share

Keywords:multi-chip package  phase-change RAM  PRAM  mobile handset 

From Samsung Electronics Co. Ltd comes the multi-chip package (MCP) with phase-change RAM (PRAM) that is backward compatible with 40nm-class NOR flash memory in both its hardware and software functionality.

Samsung has begun shipping this memory allowing mobile handset designers the convenience of having multi-chip packaging fully compatible with past stand-alone PRAM chip technology.

According to Samsung, PRAM is expected to become a major memory technology and will begin replacing NOR flash in consumer electronics designs next year. PRAM, which stores data via the phase change characteristics of its base material, an alloy of germanium, antimony and titanium, provides three-times faster data storage performance per word than NOR chips.

Samsung's new PRAM-packaged memory combines the non-volatile nature of flash memory with the high-speed capability of DRAM. Its simple cell structure makes designing MCP chips for handsets a faster and easier process, with the imminent use of 30nm-class and finer process node technology to overcome long-time design difficulties inherent in NOR flash technology.

- Ismini Scouras
eeProductCenter





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